Experience 7 days full of innovations! Visit Bosch at interpack in Duesseldorf

The world’s leading trade show for the packaging industry and all related process technologies has started today. On more than 3,500 sqm, Bosch Packaging Technology presents new developments from its comprehensive portfolio for the pharmaceuticals, food, and confectionery industries combined with after-sales service solutions for preventive and reactive maintenance. …More




Keeping it clean with powders

Sigpack VPF – a revolutionary concept for powder filling
Bosch introduces the first freely scalable flat pouch machine to the market at interpack 2017 (hall 6, booth C30). Thanks to the modularization of the dosing and cross-sealing units, the Sigpack VPF is freely scalable from two to up to twelve lanes. In addition, pouch sizes are easily adjustable. The new decentralized stock of product makes it possible to package different products, such as salt and pepper, at the same time on one machine. …More



You snack it, we pack it

At interpack 2017 (hall 6, booth C58) Bosch will display its proven Woodman P3c bagger. Supported by 70 years of experience in packaging snack food, it is designed to package potato chips, tortilla chips, corn chips, extruded snacks, pretzels, and many other snack foods at high speeds of up to 120 bags per minute. …More


Industry 4.0 live at Interpack

People, machines, processes, superordinate IT – everything and everyone is connected in the factory of the future. But which specific advantages does Industry 4.0 offer for process and packaging technology? At interpack 2017, visitors to Bosch’s booth can experience live, how higher production transparency increases productivity, quality and efficiency in day-to-day work. …More


Raise the bar

Whether chocolate, cereal or protein – consumers are increasingly asking for more individual bar products. In order to live up to manufacturers’ growing demands for maximum productivity, flexibility and quality, Bosch is unveiling its seamlessly integrated bar production system at interpack 2017. …More




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