Packaging the taste of Scotland

Meyrick Hilton Long and the film team had the opportunity to visit the Tunnock’s Factory in Uddingston near Glasgow to document this great success of relationship.



Bosch packs Tunnock’s Caramel Wafer Biscuits: a Success Story

Sir Boyd Tunnock is well-known for his great sense of humor and manufacturing the UK’s most popular caramel wafer biscuits. The 86-year-old Chairman and CEO of Tunnock’s world-famous Scottish family business sets high standards, not only in terms of manufacturing but also in packaging their products. In order to assure quality, Tunnock has relied on Bosch Packaging Technology’s equipment for 50 years – and recently approached the packaging experts when he needed a new line to meet the growing demand for his company’s products.


VIDEO: Click on the image to watch the video


Tunnock Factory in Scotland


Enabling growth and secure product quality

With constantly growing consumer demand, the company needed to increase production output. In order to meet this request, Tunnock’s decided to invest in an additional production line, which included a packaging line and a service package from Bosch. The aim was to increase output and flexibility on a smaller footprint compared to the existing lines. In addition, the new line had to be easy to operate, clean and maintain for fast changeovers.

Bosch Packaging Technology provided the Scottish company with a flexible and comprehensive packaging system including a buffer, two horizontal flow wrappers with intelligent infeed and a flexible case packer.

“As quality and reliability are of highest importance to me, I always buy the best equipment. I am happy with my Bosch packaging lines, and that’s why I asked them to suggest a solution for our new caramel wafer line,” explains Boyd Tunnock, the grandson of the founder.



Tunnock's Caramel Wafers

The Sigpack HCM multipack flow-wrapping machine with Sigpack FIT intelligent infeed automatically group the caramel wafer biscuits into multipacks of either four, five, six or eight products.


Tunnock's Caramel Wafers

With the Sigpack TTMC case packer, the products are fed, grouped and loaded into formed cases.



Compact footprint and easy handling

Thanks to the compact design of the new intelligent infeed, the overall footprint of the new packaging line could be reduced by four meters compared to the existing lines.

“The new Bosch packaging line is very compact. It saves us valuable floor space and achieves excellent efficiency results at maximum flexibility,” Stuart Loudon, Project Manager at Tunnock’s, says. “The machines are easy to operate, easy to clean and easy to maintain, which helps us to achieve a continuous product flow.”


Sigpack solutions

The Sigpack TTMC stands out for its versatility, making the machine highly flexible in terms of product and pack style variety.


The collaboration continues

After several months of operation, the production levels on the new line repeatedly exceed those achieved on the existing lines. “With the new line having the intelligent infeed system we expect to generate a fast return on investment based on increased efficiency, quicker changeover times and reduced maintenance costs,” Bill Gow, Financial Director at Tunnock’s, says.

And the joint projects are not over yet. Boyd Tunnock, who recently has been knighted in the Queen’s Birthday Honours for services to business and to charity, decided to invest in two more Bosch machines to assist in the company’s growth. “We are keen to take our production to the next level,” Tunnock explains. “Knowing each other’s business for more than 50 years is a great advantage and translates into an open and trustful business and personal relationship.”


Sir Boyd Tunnock and Stuart Loudon


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Meyrick Hilton Long
Sales Manager
Phone: +41 79 248-4983



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